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CST PCB Capabilities
Please select your Capabilities table here :
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PCB Capabilities
Assembly Capabilities
PCB Capabilities
| Description | Technical Parameters | Remark | |
|---|---|---|---|
| Layer | 1-40 Layer | ||
| Board Material | FR4, High Tg, Aluminum Base, High Frequency, Rogers,PTFE,FPC,Thick Copper, Paper Base, BT Base, PI Base, Rogers, Arlon, Nelco,TEFLON | ||
| Product type | Back board, HDI, Blind/Burried vias multilayer, Capacitor Embedded board, Power supply, Thick gold, Thick copper board, Impedance Control pcb ,etc | ||
| Min Trace/Space | 0.050mm(2mils) | Finished copper weight 0.5 OZ | |
| Min. Annular Ring Width | Vias: 3mils | ||
| Component Holes: 5mils | |||
| Min. Hole Size | NC drill | 0.10mm(4mil) | Finished boards |
| Laser drill | 0.10mm(4mil)(Depth≤65um) | ||
| Aspect Ratio | 16:1 | ||
| Max. Board thickness | Single and Double Side | 8.0mm | |
| Multilayer | 8.0mm | ||
| Min. Board Thickness | Single and Double Side | 0.2mm | |
| Multilayer | 4Layer: 0.40mm 6Layer: 0.60mm | ||
| 8Layer: 1.00mm 10layer: 1.20mm | |||
| Max. Board size | Single and Double Side | 609 * 609mm; 1Meter or 1.2 Meter LED aluminum Aluminum | |
| Multilayer | 610 * 810mm | ||
| Distance Between Trace and Board edge | Outline: 0.20mm | ||
| V-CUT:0.33mm(Board Thickness<1.2mm) | |||
| Solder mask | Mask Window(mil) | 2/4 | |
| Mask Bridge(mil) | 6 | Between IC pins | |
| Color | LPI, different colors(Green, Green matt, Glossy Green,Black, Black Matt, White, Red, Yellow, Blue,purple) | ||
| Silkscreen | Color | White, Black, Green;purple | |
| Surface Finish | HASL, LF-HASL, ENIG, Imm Tin, Imm Ag,OSP, Gold Finger,Rosin; peelable solder mask;Carbon . | ||
Assembly Capabilities
| Title | Value | |
|---|---|---|
| Leadtime | 1~3days for prototype ;7~10days for mass production | |
| Quantity | No MOQ ; Prototype quantity 5/10/15/20/25/30/50/100 pcs ; Small to medium quantity: 1-10000 pcs or more | |
| Assembly type | Surface mount | |
| Through hole Plug in assembly | ||
| SMT&TH mixed | ||
| IC bonding | ||
| Finish product assembly | ||
| Service options | Lead-free: RoHS compliant | |
| IPC Class III inspection | ||
| BGA X-ray inspected | ||
| AOI test | ||
| double sided surface mount | ||
| PCB specification | PCB size smaller than 15 mm must be panelized. | |
| Max: 1200 mm*15mm | ||
| Material: Fr4 ,high frequency material ,aluminum base ;Flextrible material | ||
| Surface finish: lead / lead-free HASL, ENIG, silver, OSP,Rosin,Carbon | ||
| components procurement | Components sourcing | |
| Full procurement | ||
| Partial procurement | ||
| Component types | SMD 0201 or larger 0402,0603 ,0805,1206 | |
| BGA 0.35 mm pitch | ||
| 0.35 pitch QFP,QFN,and Tssop Chips footprint | ||
| sot23-5 or sot-23 ,or other footprint | ||
| TH part | ||
| SMT parts presentation | Bulk | |
| Cut tape | ||
| Partial reel | ||
| Reel | ||
| Tube | ||
| Tray | ||
| Solder types | lead soldering ; Lead-free: RoHS compliant; | |
| Stencils | Laser-Electrolytic polishing cut stainless steel; polishing-cut stainless steel | |
| Miscellaneous | IC programming,finished pcba functional testing | |
