Number of Layers: 8-Layer Base Material: RF-4 Copper Thickness: 0.2-3.0oz
Board Thickness: 0.2-3.0mm Min. Hole Size: 0.25mm Min. Line Width: 0.1mm
Min. Line Spacing: 0.1mm
Surface Finishing: lead free hasl,ENIG, OSP, HASL,immersion gold
Certification: ISO9001,UL,ROHS
Soldermask: Green,blue,red,yellow,black,white,etc
Other servie: Board Copy and design, Parts purchased and assembly
Packaging & Delivery
Packaging Detail: vacuum parking,opp bag
Delivery Detail: 5-28 working days
Specifications
1. ENIG PCB, Eight layers PCB, multilayer PCB
2. FR-4 base material
0.1mm line width/spacing
0.2mm Min hole diameter
buried and blind hole multi-layer pcb
PCB Capability:
Max Layer Count for rigid PCB: 1-12
PCB Board Thickness: 14mil -175mil
Drill to Metal: 6mil
Hole Size: 4mil
Inner layer Registration: 3mil
Line Width & Space Inner/Outer: 3mil/3mil (minimum)
Aspect Ratio: Min Solder mask Dam: 2.5mil
Controlled Impedance: +/- 8%
Max Internal Copper Wt.: 3 oz
Advanced Technologies: Blind/Buried Via, HDI Micro via
Surface Treatment: ENIG, OSP, Immersion Silver/Tin, Lead free HAL
Materials: FR4, High Tg Epoxy, Halogen Free
Certificates: TS16949, ISO14001 and UL
Price: Quite competitive especially for orders in huge quantities
Products application: Computer, Communication, Test & Control system, Medical Equipment etc.
Lead Time: 5-20 days (Depends on Q’ty, production status etc. )
Delivery Mode: UPS, DHL, FedEx, TNT, standard flight & vessel
