Base Material: PI adhesive 1mil Copper Thickness: 1OZ; Board Thickness: 0.2mm
Min. Hole Size: 0.3mm Min. Line Width: 0.06mm Min. Line Spacing: 0.06mm
Surface Finishing: Immersion gold; gold thickness: 0.03-0.08um
Packaging & Delivery
Packaging Detail: Inner packing: 100pcs/plastic bag Outer packing: normal carton packing. less than 10kg per packing
Delivery Detail: 5-8dsy for sample. 8-10day for mass production
Specifications
camera flex pcb
1)1 to 8 layer FPC inlude rigid-flex board
2)Immersion Gold, osp. HASL lead free
3)ISO 14001/9001,Rohs ,SGS
Camera flex fpc
2)Conductor:Hoz copper 0.005″thick solder flash
3) base layer:0.001 thickness polymide+adhesive
4)Cover layer:0.001 thickk polyimide
5)0.002 thick polyimide stiffener
6) PANEL : Accept 10% xout boards
7) 5-8days sample delivery. 8-10 mass production for mutilayer board
8) qty: 10.000pcs per month and export to USA
We can provide all type of FPC production inlcude 8 layer rigid-flex board. HDI ( blind and bury board)
We are dedicated to providing the best FPC products to our customers with our advanced equipment, meticulous techniques, stringent quality control, scientific operational management, reasonable pricing, and trust-worthy business practice.
NNumber of Layer
1~8(Rigid-Flex & Multilayers FPC)
Min. Track
Width/Spacing
Single Sided
0.030 mm / 0.040 mm
Double Sided
0.030 mm / 0.050 mm
Min. Hole
Diameter
Drilling P.T.H.
0.2 mm
Punching
1.0 mm
Dimension
Tolerances
Conductor Width (W)
0.020 mm
W0.5mm
Hole Diameter (H)
0.05 mm (withP.T.H.0.1mm)
H1.5mm
Accumulated Pitch (P)
0.015 mm
P25mm
Outline Dimension (L)
0.05 mm
L50 mm
Conductors and Outline (C)
0.15 mm (Special 0.07mm)
C5.0 mm
Conductors and Coverlay
0.3~0.5 mm
Surface Treatment on
Terminals and land Areas
Soft or Hard Ni/Au Sn/Pb (2~60¦Ìm) Primary FluxCarbon Printed (4~10¦Ìm Silver Gel printed
Insulation Resistance
1000MW
IPC-TM-650 2.6.3.2
at Ambient
